SMT Automation AND Production Efficiency

SMT fully automatic lines enable to manage the entire flow of the semi-finished product. Highly qualified technical personnel monitor performance in terms of control processes and productivity. At each stage of the SMT process all quality controls are performed with a totally automatic optical inspection line analysing solder joints, component presence and identification data. 

Soldering paste, a qualitative core process, is through an automatic optical alignment machine.  To ensure high quality standards post-print inspections of circuit boards and laminate apertures can be set up as well as drying and solvent cleaning operations. The extensive choice of pick and place machines enables to manage a complete range of components available on the market. 

The range can host up to 200 8mm feeders with a production capability of 15,000/20,000 components per hour. The wide range of feeders available allows for the management of electronic components in tube, tray or bar format. The compressed hot air reflow oven consists of layers upon layers of heating components allowing for the distribution of heat with maximum efficiency and evenly throughout the surface. A heat transfer mechanism removes excessive heat from the soldered board and reduces the temperature. 

It is possible, in this way, to achieve accurate thermal profiling irrespective of existing thermal load conditions. Each thermal profile is studied and carefully validated for each circuit board using a special thermocouple sensor, duly registered and calibrated. Automatic optical inspection is performed through a camera able to detect and reflow soldered components. 

The machine is equipped with an auto-detection software system that allows better control performance in each subsequent batch. The whole station can work independently by recognizing circuit boards and programmes through codes and bars.